Desk lead free reflow oven F3

Features:1 with infrared and hot air cycle and centrifugal fan which is little noise and large air pressure, it is high successful welding.2 the reflow oven can weld QFPBGACSP, the min chip is 0402, 0.3mm space of IC. And it is suitable for single side, double side, multi size board3 push-pull drawer, it is convenient for use. It can be used to unsolder, repair and other function.4 heaters can be used for long time and dont need clean.5 it is easy to operate. Automatic welding and easy using.6 it is suitable for small and middle enterprises, university and scientific research. this machine can test SMD in industry. Technology parameters:1 temperature segment: 50 segments which is the same with 50 temperature zones. It can simulate preheating, heating, heat preservation, cooling and other parameters. SMT temperature profile is the international standard. Customers can adjust temperature profile according to actual request.2 max PCB size: 250mm x 180mm3 highest temperature: 3504 power: AC 220V5 rated power: 0.8KW6 weight: about 10kg7 dimension: 530 mm x 330 mm x 250 mm